ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,532,839, issued on Jan. 27, was assigned to Pioneer Hi-Bred International Inc. (Johnston, Iowa). "Maize hybrid X06T064" was invented by Everton... Read More
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,537,287, issued on Jan. 27, was assigned to LENOVO (BEIJING) Ltd. (Beijing). "Electronic device" was invented by Yuling Xu (Beijing) and Dafei ... Read More
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,534,198, issued on Jan. 27. "Apparatus and method for installing equipment at a remote location" was invented by Carlos Leal (Waterloo, Canada)... Read More
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,537,411, issued on Jan. 27, was assigned to DENSO Corp. (Kariya, Japan). "Rotary electric machine" was invented by Eiji Kiba (Kariya, Japan) an... Read More
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,535,933, issued on Jan. 27. "Systems, methods and devices for aiding in the decolonization of bacteria" was invented by Alison Carrigg (Lake Os... Read More
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,537,231, issued on Jan. 27, was assigned to LG ENERGY SOLUTION LTD. (Seoul, South Korea). "Electrode assembly, cylindrical battery cell, and ba... Read More
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,611, issued on Jan. 27, was assigned to Sensor Electronic Technology Inc. (Columbia, S.C.). "Semiconductor heterostructure with band gap co... Read More
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,185, issued on Jan. 27, was assigned to InterDigital Patent Holdings Inc. (Wilmington, Del.). "Methods of delivery mode switch for multicas... Read More
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,832, issued on Jan. 27, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taipei, Taiwan). "Power chip packaging structure" was invent... Read More
ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,533,873, issued on Jan. 27, was assigned to SK SILTRON Co. LTD. (Gyeongsangbuk-Do, South Korea). "Device and method for separating wafers" was ... Read More